products

Acid Copper Plating Process

8 Volt - 250/500/750/1000/1500 Amps

Air/ Oil cooled , with deamer and digital meters

Additional facility : Timer, Chiller unit, Amp Totalizer, Dozing pump for Brighteners.

Vacuum type blower @ Capacity of 0.5/1/2/3/5 HP with Air Filters

Water Cooled Air pump with Mechanical Seal @ Capacity of 1/2/5 HP

Fabricated with MS and Rubber Lined/ PVC lined

Fabricated with PP with wall thickness of 10/12 mm

Additional facility : Air Agitation Coil, Anode-Cathode Brackets, Outside FRP lining.

125 LPM Magnetic Pump with PP Chamber @ 2500 LPH Actual Filtration Capacity

1 HP Mechanical Pump with MS Chamber @ 5000 LPH Actual Filtration Capacity

2 HP Mechanical Pump with MS Chamber @ 10000 LPH Actual Filtration Capacity

Titanium Pipe @ Diameter from 0.5’ to 1.5’ with wall thickness 1.5 mm to 3 mm.

Titanium Basket with Solid Huck.

Temperature :	20 to 30 ° C.
Voltage :	2 to 4 Volt DC.
Current :	30 to 60 Amps/ Sq. Ft.
Bath Composition : Copper Sulphate	200-220 gms/ltr
Sulphuric Acid :	35 – 45 ml/ltr.
Chloride :	90 - 140 ppm/ltr.
Carrier Brightener :	8 – 10 ml/ltr.
Leveller :	3- 4 ml/ltr.
Maint. Brightner :	0.5 – 2 ml/ltr.
Anodes :	Phosphorised Copper Anode (0.3% Phosph.)
Rate of Deposition :	25 micron in 30 min @ 30 Amp/sq.ft.
Filtration :	2 hrs of working days.
Air Agitation :	Vigorous and continue while process, Oil free Air should be employed.
Brightener maintenance :	Carrier Brightener @ 0.1 % to 0.2% of bath volume. Leveller @ 100 to 200 ml/ KAH Maint. Brightener @ 350 to 450 ml/KAH